Memory Hardware Engineer
Description and Requirements
Employer: Lenovo Japan, LLCWork location: Minato-mirai (Yokohama-shi); (*3 onsite and 2 remote days in a week could be applicable)Smoking: Not allowed in the office, but smoking room is available in 21st floor of Minato-mirai Center BuildingEmployment condition: Permanent Staff (Probation period: 6 months)Expected salary: Depending on the current salary and experience, we would make our decision. Discretionary labor system allowance: Applicable for Band 6 (50,000 JPY per a month)Working hours: 9:00-17:45 (Rest time: 1 hour (12:00-13:00))Holidays: Saturday, Sunday, national holidays, year-end holiday, established anniversary day, special holiday, and compensatory holidaySocial insurance and benefits: Comprised of Pension, Health, Unemployment and Worker's Accident Compensation, Defined-contribution pension, property accumulation savings, Lenovo employee group life insurance, etc.■About Organization
- Report to : Director, Memory & Power Technology
- Subordinates : None
- Number of Peers : 9
■Roles and responsibilities
- Technical project management of Memory for ThinkPad
- Communication interface to suppliers and Lenovo internal cross functional teams for related projects’ technical issues of memory
- Creates test plan / report for memory qualification
- Directs/review supplier & outsourcing vendor for qualification testing (approve/dispute results, etc.)
- Performs pre-qualification testing, design review, and critical qualification tests
- Directs defect analysis and problem resolution. Manage suppliers & outsourcing vendors to resolve issues and review/approve fix plan
- Support Product Development to enable emerging memory technologies with technical expertise
- Report Qualification Status. Make an organized presentation for technical details.
■Key Interaction with:
- Development teams in Lenovo/NECPC Japan, Lenovo China, Lenovo US
- System Development team (EE, ME, BIOS, SW)
- Product Assurance team (PAPM, HWPA, SWPA)
- Product Engineering team
- Strategic Technology Innovation Center
- Subsystem Development team
- Worldwide Lenovo operation team
- Memory Operations Team (GCM, GSM, SQE, Service)
- Offering Core Team (PBM, TPM, Marketing)
- Quality Team (PQE, MQE, PE, SQE)
- Product planning team
- Supplier Partners
- Memory suppliers (Samsung, SK Hynix, Micron, CXMT, Kingston, Ramaxel)
- CPU suppliers (Intel, AMD, Qualcomm, NV)
- ODM partners (LCFC, Wistron, etc)
- Outsourcing vendors
RequirementsMust Have – essential
- 3 years minimum experience in memory development especially qualifications or project management.
- Basic knowledge of memory, PC hardware, CPU, motherboard, Bios.
- Good project management skills
- Good oral and written English skills
- Ensure timely response and accurate communication
- Proactive in deep analysis & improvement
- Strong interest in creation & innovation
Good to have - desirable
- Better to speak in Chinese and Japanese
- Experience of memory design, testing, wafer manufacturing
- Experience of memory and motherboard failure analysis
- Experience of LLM, AIPC, memory signal testing, memory communication with XPU
- Failure analysis skills
- Organized English Presentation
- Good negotiation skill
Typical Candidate
- Memory development / qualification / testing engineer who ever worked in PC company, Device company for memory or ODM
Additional Locations: * Japan - Kanagawa - Yokohama-shi * Japan * Japan - Kanagawa * Japan - Kanagawa - Yokohama-shi